MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 287
... layer's thickness . The color of the surface of an SiO2 layer is the result of the interference of the reflected light rays . It is thus not a surprise that the same color may repeat with different layer thicknesses . Table 8.5 offers a ...
... layer's thickness . The color of the surface of an SiO2 layer is the result of the interference of the reflected light rays . It is thus not a surprise that the same color may repeat with different layer thicknesses . Table 8.5 offers a ...
Page 290
... layer X Hot silicon substrate ( a ) Gas flow over substrate surface x Hot silicon surface ( b ) Velocity profile and boundary layer Let us now take a look at the situation illustrated in Figure 8.10a , where the re- actant and the ...
... layer X Hot silicon substrate ( a ) Gas flow over substrate surface x Hot silicon surface ( b ) Velocity profile and boundary layer Let us now take a look at the situation illustrated in Figure 8.10a , where the re- actant and the ...
Page 382
... layer . Polysilicon is chosen to be the material for the cell gripper structure . A 1.2 - μm - thick polysilicon layer is deposited over the oxide layer with a medium - temperature LPCVD process , with detail parameters provided by the ...
... layer . Polysilicon is chosen to be the material for the cell gripper structure . A 1.2 - μm - thick polysilicon layer is deposited over the oxide layer with a medium - temperature LPCVD process , with detail parameters provided by the ...
Common terms and phrases
accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus