MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page vii
... Selection of Materials 337 10.2.3 Selection of Manufacturing Processes 339 10.2.4 Selection of Signal Transduction 340 10.2.5 Electromechanical System 342 10.2.6 Packaging 342 346 10.9.3 How to Choose a CAD Package 379 10.9.4 Design ...
... Selection of Materials 337 10.2.3 Selection of Manufacturing Processes 339 10.2.4 Selection of Signal Transduction 340 10.2.5 Electromechanical System 342 10.2.6 Packaging 342 346 10.9.3 How to Choose a CAD Package 379 10.9.4 Design ...
Page 167
... selected fluids are presented in Table 4.3 in Chapter 4. Another measure of fluid viscosity , called the kinematic viscosity v , is used in fluid mechanics analysis . It is defined as v = μ / p , in which p is the mass density of the ...
... selected fluids are presented in Table 4.3 in Chapter 4. Another measure of fluid viscosity , called the kinematic viscosity v , is used in fluid mechanics analysis . It is defined as v = μ / p , in which p is the mass density of the ...
Page 337
... selection of manufacturing methods for the product . The availability of a fabrication facility for the intended product ... selected for the systems design . Principal Substrate Materials There are two types of substrate materials : ( 1 ) ...
... selection of manufacturing methods for the product . The availability of a fabrication facility for the intended product ... selected for the systems design . Principal Substrate Materials There are two types of substrate materials : ( 1 ) ...
Common terms and phrases
accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus