MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 392
... wire bonds . These components are encap- sulated in an epoxy molding compound by means of injection molding . There are generally two types of interconnect : J leads and gull - wing leads , as shown in Figure 11.2b . The interconnects ...
... wire bonds . These components are encap- sulated in an epoxy molding compound by means of injection molding . There are generally two types of interconnect : J leads and gull - wing leads , as shown in Figure 11.2b . The interconnects ...
Page 395
... wire bonds for electronic signal transmission and transduction , such as the embedded piezoresistors in a pressure sensor die and the circuits that connect them ( see Figs . 2.8 and 10.4 ) . In some cases , that includes bonding the lead ...
... wire bonds for electronic signal transmission and transduction , such as the embedded piezoresistors in a pressure sensor die and the circuits that connect them ( see Figs . 2.8 and 10.4 ) . In some cases , that includes bonding the lead ...
Page 396
... Wire bond Piezoelectric M Wire bond Piezoelectric M - Silicon diaphragm Constraint Die attach Die attach Casing base Casing Interconnect Encapsulation of dies and wire bonds in microsystem packaging can vary from plas- tic to stainless ...
... Wire bond Piezoelectric M Wire bond Piezoelectric M - Silicon diaphragm Constraint Die attach Die attach Casing base Casing Interconnect Encapsulation of dies and wire bonds in microsystem packaging can vary from plas- tic to stainless ...
Common terms and phrases
accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus