Low Dielectric Constant Materials for IC ApplicationsPaul S. Ho, Jihperng Leu, Wei William Lee Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for |
Contents
Overview on Low Dielectric Constant Materials | 1 |
Structure and Property Characterization | 3 |
Integration of SILK Semiconductor Dielectric | 10 |
References | 19 |
3 | 44 |
References | 68 |
of Lowk Dielectric Porous Thin Films Determined | 75 |
Vapor Deposition of Lowk Polymeric Dielectrics | 95 |
References | 198 |
References | 218 |
of Metal Atoms | 224 |
7 | 247 |
1 | 253 |
3 | 260 |
6 | 274 |
J J Waeterloos | 277 |
Other editions - View all
Low Dielectric Constant Materials for IC Applications Paul S. Ho,Jihperng Leu,Wei William Lee Limited preview - 2012 |
Low Dielectric Constant Materials for IC Applications Paul S. Ho,Jihperng Leu,Wei William Lee No preview available - 2012 |
Common terms and phrases
a-C:F films absorption adhesion anisotropy annealing Appl as-deposited bending-beam biased HDP-CVD FSG birefringence bonds BPDA-PDA capacitance chemical coefficient copolymers crosslinked damascene decrease deposition rate dielectric constant electron etch rate F/C ratio film density film thickness fluorine fluorine concentration fluorocarbon fluoropolymers g/cm³ gapfilling hardmask HDP-CVD FSG film heating in-plane increase integration interconnect interface layer low dielectric constant low-k materials lower matrix measured mechanical mesoporous silica metal lines modulus moisture uptake molecular weight monomer MSSQ nanoporous organosilicate out-of-plane oxide Parylene Parylene-N phase Phys plasma PMDA-ODA polarization polyimide polymer polymerization pore porogen porosity porous films precursor Proc refractive index resin sample scattering silicon silicon dioxide silsesquioxane SiO2 SiO2 film solvent spectra structure substrate surface surfactants Symp techniques Technol Teflon-AF temperature thermal conductivity thermal cycle thermal stability thermal stress thin films vapor deposition vitrification voltage X-ray xerogel