MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 62
... accelerometers are built on the principles of mechanical vibration , as will be described in detail in Chapter 4. Principal components of an accelerometer are a mass supported by springs . The mass is often attached to a dashpot that ...
... accelerometers are built on the principles of mechanical vibration , as will be described in detail in Chapter 4. Principal components of an accelerometer are a mass supported by springs . The mass is often attached to a dashpot that ...
Page 113
... accelerometer . This formulation can also be used as the basis of the design of microaccelerometers . Figure 4.14a illustrates a typical accelerometer that consists of a seismic mass supported by a spring and a dashpot . The casing of ...
... accelerometer . This formulation can also be used as the basis of the design of microaccelerometers . Figure 4.14a illustrates a typical accelerometer that consists of a seismic mass supported by a spring and a dashpot . The casing of ...
Page 115
... accelerometer and C с h = = Cc 2mwn is the ratio of the damping coefficients of the damping medium in the micro- accelerometer to its critical damping , with c = 2mw , [ see the case in Equation ( 4.20b ) ] . One may readily observe ...
... accelerometer and C с h = = Cc 2mwn is the ratio of the damping coefficients of the damping medium in the micro- accelerometer to its critical damping , with c = 2mw , [ see the case in Equation ( 4.20b ) ] . One may readily observe ...
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accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus