## MEMS and microsystems: design and manufactureMicrosystems and MEMS technology represents one of the biggest breakthroughs in the area of mechanical and electronic technology to occur in recent years. This is the technology of extremely small and powerful devices – and systems built around such devices – which have mechanical and electrical components. MEMS technology is beginning to explode, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarize future engineers with this broad-ranging technology. Hsu's MEMS & MICROSYSTEMS text provides an engineering design approach to MEMS and microsystems, appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases, and applied problems. The book is appropriate for Mechanical and Aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical Engineering students will be provided strong coverage of the mechanical side of MEMS, something they may not receive from other courses in their curriculum. |

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Page 160

... geometry, (2) complex geometry and loading/

loading and

the continuum into a number of subdivisions, a process called discretization.

... geometry, (2) complex geometry and loading/

**boundary conditions**, (3) complexloading and

**boundary conditions**. 26. ... and**boundary condition**, (3) to subdividethe continuum into a number of subdivisions, a process called discretization.

Page 194

Boundary position: rs Thus, because of this resistance, the surface temperature of

the solid is not equal to the bulk fluid ... 5.8.6 The

5.38) is used to determine the temperature distribution T(r, t) in a MEMS device ...

Boundary position: rs Thus, because of this resistance, the surface temperature of

the solid is not equal to the bulk fluid ... 5.8.6 The

**Boundary Conditions**Equation (5.38) is used to determine the temperature distribution T(r, t) in a MEMS device ...

Page 199

The

to: dx 1.57 x 10"3 3C/cm We may apply a factor ... Two possible

boundary ...

The

**boundary condition**in the above exp sion for the present case is thus equalto: dx 1.57 x 10"3 3C/cm We may apply a factor ... Two possible

**boundary****conditions**can be applied at the bottom surface of the beam; (1) the insulatedboundary ...

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### Common terms and phrases

accelerometer actuators analysis applied atoms beam boundary conditions capacitance capillary channel chemical coefficient components deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces energy engineering Equation etchants example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux illustrated in Figure interface involves ions layer LIGA process Madou mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules natural frequency output oxidation p-type phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thermal expansion thermal stresses thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus