MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
From inside the book
Results 1-3 of 37
Page 154
... finite element method is the only viable way to attain credible solutions . Following is a brief introduction of ... element equations will be presented in Chapter 10. What the reader will learn from the following is the essential input ...
... finite element method is the only viable way to attain credible solutions . Following is a brief introduction of ... element equations will be presented in Chapter 10. What the reader will learn from the following is the essential input ...
Page 157
... finite element code by the user . As mentioned in Section 4.7.1 , the user needs to recognize stress / strain concentrations by allowing denser and smaller elements in the parts of the structure with abrupt change of geometry . It is ...
... finite element code by the user . As mentioned in Section 4.7.1 , the user needs to recognize stress / strain concentrations by allowing denser and smaller elements in the parts of the structure with abrupt change of geometry . It is ...
Page 353
... FINITE ELEMENT METHOD We have demonstrated that theories and principles of continuum mechanics and heat transfer as presented in Chapters 4 and 5 can be used in the mechanical design analy- sis of many MEMS and microsystem components ...
... FINITE ELEMENT METHOD We have demonstrated that theories and principles of continuum mechanics and heat transfer as presented in Chapters 4 and 5 can be used in the mechanical design analy- sis of many MEMS and microsystem components ...
Other editions - View all
Common terms and phrases
accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus