MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 283
... oxide is produced by thermal oxidation in an electric resistance furnace . A typical furnace consists of a large fused quartz tube as illustrated in Figure 8.7 . Re- sistance heating coils surround the tube to provide the necessary high ...
... oxide is produced by thermal oxidation in an electric resistance furnace . A typical furnace consists of a large fused quartz tube as illustrated in Figure 8.7 . Re- sistance heating coils surround the tube to provide the necessary high ...
Page 285
... oxide layer , do , that may be in existence before the oxidation process begins . For wet oxidation , or in the case do = 0 , 7 = 0 . Equations ( 8.9 ) and ( 8.10 ) can be used to estimate the thickness of the oxide layer at time t ...
... oxide layer , do , that may be in existence before the oxidation process begins . For wet oxidation , or in the case do = 0 , 7 = 0 . Equations ( 8.9 ) and ( 8.10 ) can be used to estimate the thickness of the oxide layer at time t ...
Page 287
Design and Manufacture Tai-Ran Hsu. Dry oxidation thickness , μm Wet oxidation thickness , μm Eq . ( a ) for small time Eq . ( b ) for larger time 0.068 0.0989 1.018 0.5572 We may observe from the above summary of results that wet oxidation ...
Design and Manufacture Tai-Ran Hsu. Dry oxidation thickness , μm Wet oxidation thickness , μm Eq . ( a ) for small time Eq . ( b ) for larger time 0.068 0.0989 1.018 0.5572 We may observe from the above summary of results that wet oxidation ...
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accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus