MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 390
... packaging of these devices and systems is a major challenge to the industry because microsystem packaging tech- nology is far from being as mature as that for microelectronic packaging . Micro- systems packaging , in a broader sense ...
... packaging of these devices and systems is a major challenge to the industry because microsystem packaging tech- nology is far from being as mature as that for microelectronic packaging . Micro- systems packaging , in a broader sense ...
Page 394
... packaging of some more common devices and systems , such as micropressure sensors and actua- tors as presented in Chapter 2. We will further assume that substrate materials are made of silicon unless ... Packaging Die-Level Packaging.
... packaging of some more common devices and systems , such as micropressure sensors and actua- tors as presented in Chapter 2. We will further assume that substrate materials are made of silicon unless ... Packaging Die-Level Packaging.
Page 396
... packaging can vary from plas- tic to stainless steel casings ( Figure 11.4 ) . The latter encapsulation material is not used in microelectronic packaging . There are several other issues relating to die ... Packaging System-Level Packaging.
... packaging can vary from plas- tic to stainless steel casings ( Figure 11.4 ) . The latter encapsulation material is not used in microelectronic packaging . There are several other issues relating to die ... Packaging System-Level Packaging.
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Common terms and phrases
accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus