MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 341
... piezoresistors , the wire bond , and the metal circuitry and film pads from direct contact with the pressurized medium . 2. Place the transduction system at the bottom face of the die . In this case , a much more complex process for ...
... piezoresistors , the wire bond , and the metal circuitry and film pads from direct contact with the pressurized medium . 2. Place the transduction system at the bottom face of the die . In this case , a much more complex process for ...
Page 416
... Piezoresistors are used to convert the mechanical stresses induced in the diaphragm of a micropressure sensor to the corresponding change of electric resistance . There are a number of ways that these piezoresistors can be installed ...
... Piezoresistors are used to convert the mechanical stresses induced in the diaphragm of a micropressure sensor to the corresponding change of electric resistance . There are a number of ways that these piezoresistors can be installed ...
Page 417
... piezoresistor designations shown in Figure 11.23a . Correct measurements of the resistance change in piezoresistors ( due to the ap- plication of pressure on the diaphragm ) by the Wheatstone bridge circuitry require proper conditioning ...
... piezoresistor designations shown in Figure 11.23a . Correct measurements of the resistance change in piezoresistors ( due to the ap- plication of pressure on the diaphragm ) by the Wheatstone bridge circuitry require proper conditioning ...
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Common terms and phrases
accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus