MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 18
... ratio micro- structures ( aspect ratio = ratio of the dimensions of the height to those of the surface ) have been successfully manufactured by the LIGA process , as shown in Figures 1.9 , 10 , and 11. This special micromanufacturing ...
... ratio micro- structures ( aspect ratio = ratio of the dimensions of the height to those of the surface ) have been successfully manufactured by the LIGA process , as shown in Figures 1.9 , 10 , and 11. This special micromanufacturing ...
Page 317
... ratios . The aspect ratio ( A / P ) of a MEMS component is defined as the ratio of its dimension in the depth to those in the surface . For dry etching , the A / P is less than 15. Another problem with dry etching relates to the ...
... ratios . The aspect ratio ( A / P ) of a MEMS component is defined as the ratio of its dimension in the depth to those in the surface . For dry etching , the A / P is less than 15. Another problem with dry etching relates to the ...
Page 339
... ratio . ( The ratio of the dimension in depth to that of the plane defines the aspect ratio in MEMS industry . The height of microstructures in bulk micromachining is limited by standard silicon wafer thickness . ) The process involves ...
... ratio . ( The ratio of the dimension in depth to that of the plane defines the aspect ratio in MEMS industry . The height of microstructures in bulk micromachining is limited by standard silicon wafer thickness . ) The process involves ...
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accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus