MEMS and Microsystems: Design and ManufactureMicrosystems and MEMS technology is one of the biggest breakthroughs in the area of mechanical and electronic technology in recent years. This is the technology of extremely small and powerful devices, and systems built around them, which have mechanical and electrical components. MEMS technology is expanding rapidly, with major application areas being telecommunications, biomedical technology, manufacturing and robotic systems, transportation and aerospace. Academics are desperate for texts to familiarise future engineers with this broad-ranging technology. This text provides an engineering design approach to MEMS and microsystems which is appropriate for professionals and senior level students. This design approach is conveyed through good examples, cases and applied problems. The book is appropriate for mechanical and aerospace engineers, since it carefully explains the electrical/electronic aspects of the subject. Electrical engineering students will be given strong coverage of the mechanical side of MEMS, something they may not receive elsewhere. |
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Page 48
... wire materials and the range of tem- perature measurements . Seebeck coefficients for common thermocouples are given in Table 2.3 . Figure 2.13 | Schematics of thermocouples . Heat Metal wire A Bead Metal wire B Metal wire A Heat Cold ...
... wire materials and the range of tem- perature measurements . Seebeck coefficients for common thermocouples are given in Table 2.3 . Figure 2.13 | Schematics of thermocouples . Heat Metal wire A Bead Metal wire B Metal wire A Heat Cold ...
Page 392
... wire - bonded ) circuit board using solders in the case of surface mount packaging . Figure 11.2 | A typical plastic - encapsulated microcircuit . Die pad and die attach Epoxy encapsulant Wire bond Silicon die with IC Interconnects ...
... wire - bonded ) circuit board using solders in the case of surface mount packaging . Figure 11.2 | A typical plastic - encapsulated microcircuit . Die pad and die attach Epoxy encapsulant Wire bond Silicon die with IC Interconnects ...
Page 405
... wire Capillary tool Heat Metal pad Substrate Substrate ( a ) Heating ( b ) Pressing Substrate ( c ) After bonding Wedge - wedge Ultrasonic Bonding Unlike thermocompression bonding , ultrasonic wire bonding is a low - temperature process ...
... wire Capillary tool Heat Metal pad Substrate Substrate ( a ) Heating ( b ) Pressing Substrate ( c ) After bonding Wedge - wedge Ultrasonic Bonding Unlike thermocompression bonding , ultrasonic wire bonding is a low - temperature process ...
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Common terms and phrases
accelerometer analysis applications atoms beam boundary conditions capacitance capillary chemical coefficient components Constraint base deflection deposition described in Chapter devices diaphragm diffusion dopant doping dynamic electric resistance electrons electrostatic forces engineering Equation etchants etching example fabrication finite element finite element analysis fluid flow fracture geometry heat conduction heat flux heat transfer illustrated in Figure interface involves ions layer LIGA process mask mass maximum mechanical MEMS and microsystems metal micro microaccelerometer microdevices microelectronics microfabrication microfluidics micromanufacturing micropressure sensors microsensors microstructures microsystem design microsystem packaging microvalves molecules n-type output oxidation phonon photolithography photoresist piezoelectric piezoresistors plane plasma plate polymers pressure sensor production pumping ratio reactant scaling shear shown in Figure signal transduction silicon dioxide silicon substrate SiO2 solid solution structure submicrometer substrate materials surface micromachining Table techniques temperature thickness thin films transducers tube velocity vibration voltage wet etching wire bonds Young's modulus