Engineering Materials And Their ApplicationsThis edition of the classic text/reference book has been updated and revised to provide balanced coverage of metals, ceramics, polymers and composites. The first five chapters assess the different structures of metals, ceramics and polymers and how stress and temperature affect them. Demonstrates how to optimize a material's structure by using equilibrium data (phase diagrams) and nonequilibrium conditions, especially precipitation hardening. Discusses the structures, characteristics and applications of the important materials in each field. Considers topics common to all materials—corrosion and oxidation, failure analysis, processing of electrical and magnetic materials, materials selection and specification. Contains special chapters on advanced and large volume engineering materials plus abundant examples and problems. |
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Page 294
The normal engineering problem is to find methods of optimizing or controlling
the packing factor or, more importantly, the porosity, which is 1 minus the packing
factor. EXAMPLE 8.1 In the packaging industry container shape is important.
The normal engineering problem is to find methods of optimizing or controlling
the packing factor or, more importantly, the porosity, which is 1 minus the packing
factor. EXAMPLE 8.1 In the packaging industry container shape is important.
Page 340
For example, phenol + formaldehyde gives phenol-formaldehyde resin + water.
Network structure The structure formed when one or more of the monomers is tri-
or polyfunctional. Crosslinking Connections made between polymer molecules ...
For example, phenol + formaldehyde gives phenol-formaldehyde resin + water.
Network structure The structure formed when one or more of the monomers is tri-
or polyfunctional. Crosslinking Connections made between polymer molecules ...
Page 343
Thermosetting Polymers Phenolics (Example: phenol formaldehyde) Amino
resins (Example: urea formaldehyde) H H H H , CH O H ) H OH2 H H 9 H ^2 H 9
H Polyesters, thermoset type Epoxies H,C— OH O 0 HO) HC— OCH HOVC— (
CH2) ...
Thermosetting Polymers Phenolics (Example: phenol formaldehyde) Amino
resins (Example: urea formaldehyde) H H H H , CH O H ) H OH2 H H 9 H ^2 H 9
H Polyesters, thermoset type Epoxies H,C— OH O 0 HO) HC— OCH HOVC— (
CH2) ...
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Contents
A General View of the Problems | 3 |
Summary | 14 |
Summary | 45 |
Copyright | |
24 other sections not shown
Other editions - View all
Engineering Materials and Their Applications Richard Aloysius Flinn,Paul K. Trojan Snippet view - 1975 |
Engineering materials and their applications Richard Aloysius Flinn,Paul K. Trojan Snippet view - 1986 |
Common terms and phrases
0.8 percent carbon alloys aluminum annealing anode atoms austenite bainite band bonds brittle Calculate called carbide cast iron cathode CD CD ceramics Chap chromium coefficient cold-worked composition conductivity cooling copper corrosion covalent covalent bonds crystal curve density diffusion discussed ductile iron ductility effect elastic electrical electron holes electrons elements elongation energy engineering eutectoid example Fe2+ Fe3+ ferrite fibers field fracture glass grain graphite hardening hardness hydrogen important ionic ions liquid load magnesium magnetic martensite material matrix melt metal microstructure modulus mold molecules nickel obtain oxide oxygen pearlite percent silicon percentage phase diagram photons plane plastic polarization polymer precipitate produced properties quenching reaction resistance semiconductor shown in Fig silica sodium solid solution specimen strain stress structure surface Table temperature tensile strength thermal thermoplastic thermosetting transformation unit cell valence wavelength yield strength zinc