Materials for Electrical and Electronic Contacts: Processing, Properties, and ApplicationsThe subject of electrical contact materials is of interdisciplinary nature, demanding knowledge of pure sciences such as physics and chemistry, and applied sciences like electrical and electronics engineering, metallurgical engineering and materials science, polymer science and engineering, ceramic science and engineering, over and above the knowledge of environmental aspects particularly when dealing with disposal of products. The aim of this book is to provide state of the art information on materials, and processing and applications of electrical and electronic contacts. The book will introduce the academic community to the subject of electrical and electronic materials. For the industrial users, it is a comprehensive source of information on manufacturing, evaluation and applications of electrical and electronic contact materials. The book would be of immense utility to scientists, engineers and technocrats engaged in the field of switchgear technology, integrated circuits and microelectronics. |
From inside the book
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Page 195
... schematic of a diode in forward bias mode . According to this figure , a diode consists of a p - type region grown on n - type semiconductor separated by an interface called a pn junction . The V , is the potential difference across the ...
... schematic of a diode in forward bias mode . According to this figure , a diode consists of a p - type region grown on n - type semiconductor separated by an interface called a pn junction . The V , is the potential difference across the ...
Page 197
... schematic cross - section of a typical NMOSFET . The combination of NMOS and PMOS gives CMOS ( i.e. a complimentary metal oxide semiconductor ) . Gate Source n р ΑΙ SiO2 n Drain Si Fig . 6.7 Schematic cross section of a n - channel ...
... schematic cross - section of a typical NMOSFET . The combination of NMOS and PMOS gives CMOS ( i.e. a complimentary metal oxide semiconductor ) . Gate Source n р ΑΙ SiO2 n Drain Si Fig . 6.7 Schematic cross section of a n - channel ...
Page 375
... Schematic of ( a ) Isotropic conductive adhesive ( ICA ) showing flake type silver particles in epoxy polymer matrix and ( b ) Anisotropic conductive adhesive ( ACA ) with deformable conducting particles in polymer matrix schematic of ...
... Schematic of ( a ) Isotropic conductive adhesive ( ICA ) showing flake type silver particles in epoxy polymer matrix and ( b ) Anisotropic conductive adhesive ( ACA ) with deformable conducting particles in polymer matrix schematic of ...
Common terms and phrases
Ag-CdO Ag-SnO2 aluminium applications arc erosion atoms bonding cadmium cadmium oxide ceramic chemical chip circuit breakers components composite contacts conductive adhesives contact resistance contact surface copper density deposition developed devices diffusion electrical contact materials Electrical Contacts electroless electronic etching eutectic evaporation film flip-chip flux formation heating hence Holm Conf hybrid hybrid circuits IEEE integrated circuit interconnections intermetallic internal oxidation ions laser lead Mechanical Alloying melting point metallurgy method microelectronic microstructure molten solder Oxide Contact oxide particles package phase photoresist plating powder Powder Metallurgy Proc produced reduced reflow reflow soldering refractory metal sample Schematic semiconductor silicon silicon dioxide silver silver-cadmium oxide silver-metal oxide sintering Sn-Pb solder alloys solder bumps solder paste solution sputtering substrate surface mounting switchgear switching technique temperature thermal thickness tin-lead transistors tungsten typical vacuum voltage wafer wave soldering welding wire wire bonding X-ray