Materials for Electrical and Electronic Contacts: Processing, Properties, and ApplicationsThe subject of electrical contact materials is of interdisciplinary nature, demanding knowledge of pure sciences such as physics and chemistry, and applied sciences like electrical and electronics engineering, metallurgical engineering and materials science, polymer science and engineering, ceramic science and engineering, over and above the knowledge of environmental aspects particularly when dealing with disposal of products. The aim of this book is to provide state of the art information on materials, and processing and applications of electrical and electronic contacts. The book will introduce the academic community to the subject of electrical and electronic materials. For the industrial users, it is a comprehensive source of information on manufacturing, evaluation and applications of electrical and electronic contact materials. The book would be of immense utility to scientists, engineers and technocrats engaged in the field of switchgear technology, integrated circuits and microelectronics. |
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Page 170
... Table 4.2 gives properties and applications of some of the important silver - refractory metal composite contact materials . Silver - base composite contacts discussed in Table 4.2 are mainly used in air or oil whereas the copper - base ...
... Table 4.2 gives properties and applications of some of the important silver - refractory metal composite contact materials . Silver - base composite contacts discussed in Table 4.2 are mainly used in air or oil whereas the copper - base ...
Page 332
... table 9.3 states that more solder joints can be made with Pb - free solders as compared to tin - lead solders for equivalent solder weights . However , this does not apply to lead - free solders containing Bi , having an appreciable ...
... table 9.3 states that more solder joints can be made with Pb - free solders as compared to tin - lead solders for equivalent solder weights . However , this does not apply to lead - free solders containing Bi , having an appreciable ...
Page 334
... Table 9.6 gives a list of thermal expansion coefficients for solders ( both Sn - Pb and Pb - free ) and commonly used substrate materials . Accordingly , there are many Pb - free solders that provide a better CTE match than eutectic tin ...
... Table 9.6 gives a list of thermal expansion coefficients for solders ( both Sn - Pb and Pb - free ) and commonly used substrate materials . Accordingly , there are many Pb - free solders that provide a better CTE match than eutectic tin ...
Common terms and phrases
Ag-CdO Ag-SnO2 aluminium applications arc erosion atoms bonding cadmium cadmium oxide ceramic chemical chip circuit breakers components composite contacts conductive adhesives contact resistance contact surface copper density deposition developed devices diffusion electrical contact materials Electrical Contacts electroless electronic etching eutectic film flip-chip flux formation heating hence Holm Conf hybrid hybrid circuits IEEE integrated circuit interconnections intermetallic internal oxidation ions laser lead Mechanical Alloying melting point metallurgy method microelectronic microstructure molten solder Oxide Contact oxide particles package phase photoresist plating powder Powder Metallurgy Proc produced reduced reflow reflow soldering refractory metal sample Schematic semiconductor silicon silicon dioxide silver silver-cadmium oxide silver-metal oxide sintering Sn-Pb solder alloys solder bumps solder paste solution sputtering substrate surface mounting switchgear switching technique temperature thermal thickness tin-lead transistors tungsten typical vacuum vapor voltage wafer wave soldering welding wire wire bonding X-ray