Materials for Electrical and Electronic Contacts: Processing, Properties, and ApplicationsThe subject of electrical contact materials is of interdisciplinary nature, demanding knowledge of pure sciences such as physics and chemistry, and applied sciences like electrical and electronics engineering, metallurgical engineering and materials science, polymer science and engineering, ceramic science and engineering, over and above the knowledge of environmental aspects particularly when dealing with disposal of products. The aim of this book is to provide state of the art information on materials, and processing and applications of electrical and electronic contacts. The book will introduce the academic community to the subject of electrical and electronic materials. For the industrial users, it is a comprehensive source of information on manufacturing, evaluation and applications of electrical and electronic contact materials. The book would be of immense utility to scientists, engineers and technocrats engaged in the field of switchgear technology, integrated circuits and microelectronics. |
From inside the book
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Page 224
... Package provides electrical interconnections between the chip and the rest of the system . Package encapsulation also protects the chip from environmental degradation such as corrosion . Metallic , ceramic or polymeric encapsulation ...
... Package provides electrical interconnections between the chip and the rest of the system . Package encapsulation also protects the chip from environmental degradation such as corrosion . Metallic , ceramic or polymeric encapsulation ...
Page 226
... package must meet with certain minimum requirements . First of all the package must be as compact as possible with highest possible I / O density . The package should also offer maximum power dissipation . There should be maximum number ...
... package must meet with certain minimum requirements . First of all the package must be as compact as possible with highest possible I / O density . The package should also offer maximum power dissipation . There should be maximum number ...
Page 228
... package the leads extend from all the four sides and are parallel to the base whereas in QFP chip carriers the leads project down from all four sides of a square package . Design of a pin- grid array ( PGA ) type of IC package is ...
... package the leads extend from all the four sides and are parallel to the base whereas in QFP chip carriers the leads project down from all four sides of a square package . Design of a pin- grid array ( PGA ) type of IC package is ...
Common terms and phrases
Ag-CdO Ag-SnO2 aluminium applications arc erosion atoms bonding cadmium cadmium oxide ceramic chemical chip circuit breakers components composite contacts conductive adhesives contact resistance contact surface copper density deposition developed devices diffusion electrical contact materials Electrical Contacts electroless electronic etching eutectic evaporation film flip-chip flux formation heating hence Holm Conf hybrid hybrid circuits IEEE integrated circuit interconnections intermetallic internal oxidation ions laser lead Mechanical Alloying melting point metallurgy method microelectronic microstructure molten solder Oxide Contact oxide particles package phase photoresist plating powder Powder Metallurgy Proc produced reduced reflow reflow soldering refractory metal sample Schematic semiconductor silicon silicon dioxide silver silver-cadmium oxide silver-metal oxide sintering Sn-Pb solder alloys solder bumps solder paste solution sputtering substrate surface mounting switchgear switching technique temperature thermal thickness tin-lead transistors tungsten typical vacuum voltage wafer wave soldering welding wire wire bonding X-ray