Materials for Electrical and Electronic Contacts: Processing, Properties, and ApplicationsThe subject of electrical contact materials is of interdisciplinary nature, demanding knowledge of pure sciences such as physics and chemistry, and applied sciences like electrical and electronics engineering, metallurgical engineering and materials science, polymer science and engineering, ceramic science and engineering, over and above the knowledge of environmental aspects particularly when dealing with disposal of products. The aim of this book is to provide state of the art information on materials, and processing and applications of electrical and electronic contacts. The book will introduce the academic community to the subject of electrical and electronic materials. For the industrial users, it is a comprehensive source of information on manufacturing, evaluation and applications of electrical and electronic contact materials. The book would be of immense utility to scientists, engineers and technocrats engaged in the field of switchgear technology, integrated circuits and microelectronics. |
From inside the book
Results 1-3 of 68
Page 41
... resulting into a heterogeneous microstructural development . As a result of these problems , refinements have been made to the conven- tional internal oxidation process in order to produce a contact material with better microstructural ...
... resulting into a heterogeneous microstructural development . As a result of these problems , refinements have been made to the conven- tional internal oxidation process in order to produce a contact material with better microstructural ...
Page 249
... result of electromigration . However , hillock formation is also believed to be a consequence of thermal stresses between the conducting and insulating layers of the wafer . The difference in the coefficient of thermal expansion gives ...
... result of electromigration . However , hillock formation is also believed to be a consequence of thermal stresses between the conducting and insulating layers of the wafer . The difference in the coefficient of thermal expansion gives ...
Page 292
... result of wetting by solder and a vertically downward force starts acting upon it which is a function of ... results of the solderability of the material . Thus unlike dip test , the wetting balance test is quantitative in nature but ...
... result of wetting by solder and a vertically downward force starts acting upon it which is a function of ... results of the solderability of the material . Thus unlike dip test , the wetting balance test is quantitative in nature but ...
Common terms and phrases
Ag-CdO Ag-SnO2 aluminium applications arc erosion atoms bonding cadmium cadmium oxide ceramic chemical chip circuit breakers components composite contacts conductive adhesives contact resistance contact surface copper density deposition developed devices diffusion electrical contact materials Electrical Contacts electroless electronic etching eutectic evaporation film flip-chip flux formation heating hence Holm Conf hybrid hybrid circuits IEEE integrated circuit interconnections intermetallic internal oxidation ions laser lead Mechanical Alloying melting point metallurgy method microelectronic microstructure molten solder Oxide Contact oxide particles package phase photoresist plating powder Powder Metallurgy Proc produced reduced reflow reflow soldering refractory metal sample Schematic semiconductor silicon silicon dioxide silver silver-cadmium oxide silver-metal oxide sintering Sn-Pb solder alloys solder bumps solder paste solution sputtering substrate surface mounting switchgear switching technique temperature thermal thickness tin-lead transistors tungsten typical vacuum voltage wafer wave soldering welding wire wire bonding X-ray