Materials for Electrical and Electronic Contacts: Processing, Properties, and ApplicationsThe subject of electrical contact materials is of interdisciplinary nature, demanding knowledge of pure sciences such as physics and chemistry, and applied sciences like electrical and electronics engineering, metallurgical engineering and materials science, polymer science and engineering, ceramic science and engineering, over and above the knowledge of environmental aspects particularly when dealing with disposal of products. The aim of this book is to provide state of the art information on materials, and processing and applications of electrical and electronic contacts. The book will introduce the academic community to the subject of electrical and electronic materials. For the industrial users, it is a comprehensive source of information on manufacturing, evaluation and applications of electrical and electronic contact materials. The book would be of immense utility to scientists, engineers and technocrats engaged in the field of switchgear technology, integrated circuits and microelectronics. |
From inside the book
Results 1-3 of 14
Page 254
... Sputtering processes DC sputtering Reactive sputtering Laser - beam evaporation RF sputtering Molecular beam epitaxy lon plating Gas phase deposition APCVD LPCVD Plasma assisted CVD Magnetron sputtering Liquid phase deposition ...
... Sputtering processes DC sputtering Reactive sputtering Laser - beam evaporation RF sputtering Molecular beam epitaxy lon plating Gas phase deposition APCVD LPCVD Plasma assisted CVD Magnetron sputtering Liquid phase deposition ...
Page 264
... Sputtering is one of the most commonly used techniques of film deposition for IC fabrication . Though the equipment used for sputtering is similar in principle to that used for evaporation , the major difference is in respect of the ...
... Sputtering is one of the most commonly used techniques of film deposition for IC fabrication . Though the equipment used for sputtering is similar in principle to that used for evaporation , the major difference is in respect of the ...
Page 407
... sputtering 264 magnetron sputtering 266 reactive sputtering 265 RF sputtering 266 plating techniques 267 , 274-276 anodizing 275 electroless plating 275 electroplating 274 gas plating 267 ion plating 267 chemical vapor deposition ( CVD ) ...
... sputtering 264 magnetron sputtering 266 reactive sputtering 265 RF sputtering 266 plating techniques 267 , 274-276 anodizing 275 electroless plating 275 electroplating 274 gas plating 267 ion plating 267 chemical vapor deposition ( CVD ) ...
Common terms and phrases
Ag-CdO Ag-SnO2 aluminium applications arc erosion atoms bonding cadmium cadmium oxide ceramic chemical chip circuit breakers components composite contacts conductive adhesives contact resistance contact surface copper density deposition developed devices diffusion electrical contact materials Electrical Contacts electroless electronic etching eutectic evaporation film flip-chip flux formation heating hence Holm Conf hybrid hybrid circuits IEEE integrated circuit interconnections intermetallic internal oxidation ions laser lead Mechanical Alloying melting point metallurgy method microelectronic microstructure molten solder Oxide Contact oxide particles package phase photoresist plating powder Powder Metallurgy Proc produced reduced reflow reflow soldering refractory metal sample Schematic semiconductor silicon silicon dioxide silver silver-cadmium oxide silver-metal oxide sintering Sn-Pb solder alloys solder bumps solder paste solution sputtering substrate surface mounting switchgear switching technique temperature thermal thickness tin-lead transistors tungsten typical vacuum voltage wafer wave soldering welding wire wire bonding X-ray