Ceramography: Preparation and Analysis of Ceramic MicrostructuresCeramography provides detailed instructions on how to saw, mount, grind, polish, etch, examine, interpret and measure ceramic microstructures. This new book includes an atlas of ceramic microstructures, quantitative microstructural example problems with solutions, properties and data tables specific to ceramic microstructures, more than 100 original photographs and illustrations, and numerous practical tips and tricks of the trade. An excellent reference guide for technicians in quality control and R&D, process engineers in ceramic manufacturing, and their counterparts in engineering firms, national laboratories, research institutes, and universities. |
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Page 161
... load , whereas the values in Tables 9.2 and 9.3 were measured at much higher loads . Furthermore , the small indentation made by a low load can be difficult to measure precisely . Very high loads tend to cause cracks in the corners of ...
... load , whereas the values in Tables 9.2 and 9.3 were measured at much higher loads . Furthermore , the small indentation made by a low load can be difficult to measure precisely . Very high loads tend to cause cracks in the corners of ...
Page 163
... load . 4. Set the load and dwell time on the hardness tester . For most fully den- sified ceramics , a 500 or 1000 g load and 10 or 15 s dwell time are rec- ommended . Higher loads increase the likelihood of cracked indenta- tion ...
... load . 4. Set the load and dwell time on the hardness tester . For most fully den- sified ceramics , a 500 or 1000 g load and 10 or 15 s dwell time are rec- ommended . Higher loads increase the likelihood of cracked indenta- tion ...
Page 171
... load in three places along a 45 mm centerline , uniformly spaced between the innermost pins of the bending fixture , as shown in Fig . 9.8 ( b ) . Other loads can be used , with the risk of not enough damage by a lesser load or too much ...
... load in three places along a 45 mm centerline , uniformly spaced between the innermost pins of the bending fixture , as shown in Fig . 9.8 ( b ) . Other loads can be used , with the risk of not enough damage by a lesser load or too much ...
Contents
Ceramic Fabrication | 9 |
Sawing and Mounting | 19 |
Grinding and Polishing | 35 |
Copyright | |
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Ceramography: Preparation and Analysis of Ceramic Microstructures Richard E. Chinn Limited preview - 2002 |
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abrasive acid acoustic Al2O alumina analysis applied approximately ASTM beam binary carbide ceramics ceramographic Chapter clean coating color composition compression contain contrast crack crystal described diameter diamond direction edge electric electron electron microscope Engineered equipment field fracture furnace glass grain boundaries grain size gray levels grinding Handbook hardness heat illumination image analyzer indentation interference layer length lens less light liquid load magnification Materials mean measurement Metallographic Metals method microscope microstructure mold mounting objects optical original particles phase polarized polishing pores porosity Practice preparation pressure procedures properties reflected refractive relief removed require resin Scanning shape shown in Fig Silicon sintering slide Source specimen sputter stage standard step structure Subroutine surface Table Testing thermally etched thin section TiO2 tion toughness transmitted USA Telephone usually viewed volume