Ceramography: Preparation and Analysis of Ceramic MicrostructuresPreface p. viii About the Author p. x List of Subroutines p. xi Chapter 1 Introduction p. 1 Ceramography in Materials Science p. 1 Crystallography p. 2 Laboratory Safety p. 3 Ceramographic Laboratory Design p. 5 Chapter 2 Ceramic Fabrication p. 9 Ceramics p. 9 Commerical Fabrication of Ceramics p. 11 Laboratory Fabrication of Ceramics p. 13 Chapter 3 Sawing and Mounting p. 19 Sawing p. 19 Mounting p. 22 Edge Retention p. 30 Beveled Edge p. 31 Ceramographic Mounting Resins p. 31 Chapter 4 Grinding and Polishing p. 35 Automatic Grinding p. 35 Automatic Polishing p. 36 Manual Grinding p. 39 Manual Polishing p. 40 Grinding and Polishing Accessories p. 40 Chapter 5 Etching p. 45 Thermal Etching p. 45 Chemical Etching p. 54 Electrolytic Etching p. 56 Other Etching Methods p. 58 Overetched Ceramics p. 67 Chapter 6 Petrographic Thin-Section Preparation p. 69 Sawing p. 69 Mounting p. 70 Grinding p. 71 Chapter 7 Optics and Microscopy p. 75 The Microscope p. 75 Kohler Illumination p. 79 Magnification and Resolution p. 81 Depth of Field p. 84 Differential Interference Contrast p. 85 Dark-Field Illumination p. 86 Oil Immersion p. 87 Stereomicroscopy p. 88 Crystal Optics p. 88 Petrography--Transmitted Light and Thin Sections p. 92 Replication and Field Ceramography p. 95 Sputter Coating p. 97 Scanning Electron Microscopy p. 99 Other Microscope Types p. 103 As-Fired Surface p. 105 Stereo Pairs p. 105 Acoustic Microscopy p. 106 Confocal Laser Scanning Microscopy p. 111 Micrography p. 112 Chapter 8 Atlas of Ceramic Microstructures p. 117 Alumina p. 117 Borides p. 130 Carbides p. 130 Composites p. 132 Metallized Ceramics p. 134 Nitrides p. 136 Oxides p. 137 Silicon Carbide p. 139 Spinel p. 141 Zirconia p. 142 Chapter 9 Quantitative Ceramography p. 145 Stereology p. 145 Grain Size p. 145 Grain Shape p. 155 Porosity and Second-Phase Content p. 157 Microindentation Hardness p. 160 Toughness p. 168 Chapter 10 Qualitative Ceramography p. 177 Morphology p. 177 Phase Determination p. 178 Preferred Orientation p. 180 Fractography p. 181 Artifacts p. 185 Chapter 11 Image Analysis p. 189 Algorithm p. 190 Critical Aspects p. 193 Measurements p. 197 Digital Images p. 198 Appendix A ASTM Procedures Applicable to Ceramography p. 201 Headings in the ASTM Subject Index p. 202 Appendix B Ceramographic Equipment Manufacturers p. 203 Appendix C Abrasive Size Equivalents p. 209 Index p. 211. |
From inside the book
Results 1-3 of 27
Page 63
... wavelength ( twice 2/4 ) farther than and is shifted 2/2 out of phase with the light reflected by the interference ... wavelengths , because the incident beam is generally polychromatic . A SiC varistor was etched by reactive sputtering ...
... wavelength ( twice 2/4 ) farther than and is shifted 2/2 out of phase with the light reflected by the interference ... wavelengths , because the incident beam is generally polychromatic . A SiC varistor was etched by reactive sputtering ...
Page 91
... wavelength is unspecified . Source : Ref 2 Optically anisotropic crystals that change color or intensity of color when rotated in plane - polarized white light exhibit pleochroism . Pleochroic crystals absorb certain wavelengths in ...
... wavelength is unspecified . Source : Ref 2 Optically anisotropic crystals that change color or intensity of color when rotated in plane - polarized white light exhibit pleochroism . Pleochroic crystals absorb certain wavelengths in ...
Page 94
... wavelength or quarter - wavelength compensator . Preferred orientation ( discussed in Chapter 10 ) is indicated when the extinction ( darkening ) angle is the same for a majority of grains as the stage is rotated . Optically homogeneous ...
... wavelength or quarter - wavelength compensator . Preferred orientation ( discussed in Chapter 10 ) is indicated when the extinction ( darkening ) angle is the same for a majority of grains as the stage is rotated . Optically homogeneous ...
Contents
Ceramic Fabrication | 9 |
Sawing and Mounting | 19 |
Grinding and Polishing | 35 |
Copyright | |
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Ceramography: Preparation and Analysis of Ceramic Microstructures Richard E. Chinn Limited preview - 2002 |
Common terms and phrases
abrasive acid acoustic Al2O alumina analysis aperture approximately ASM International ASTM beam binary image camera Ceramics and Glasses ceramographic Chapter chemically etched color compression crack cross section crystal cubic diameter diamond edge Electrolytic encapsulation epoxy equipment and consumables etchant fracture surface furnace grain boundaries grain size gray levels grinding and polishing Hardness testers heat histogram image analyzer indentation interference layer Knoop Köhler illumination lens liquid load lubricant magnification Mean GS measurement Metallographic equipment Metals micrograph microindentation hardness mold monoclinic objects optical oxide particles phase diagram pixel pluckouts polarized pores porosity Prep Subroutine 5.1 ramic Reagent refractive index Relief polish replica resin room temperature rotated Scanning electron microscope secondary phases shown in Fig Silicon carbide sintering slide specimen spinel sputter coated step Subroutine Testing thermally etched thin section TiO2 tion toughness tube ultrasonic USA Telephone vacuum wavelength x-ray zirconia ZrO2 μη