Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Results 1-5 of 43
Page 6
... Electrochem. Soc. 117, 982 (1970). C. W. Wilmsen. Thin Solid Films 39, 105 (1976). C. J. Dell'Oca, D. L. Pulfrey, and L. Young, Phys. Thin Films 6, l (1971). J. F. O'Hanlon, J. Vac. Sci. Techno]. 7, 330, (1970). J. F. O'Hanlon, in ...
... Electrochem. Soc. 117, 982 (1970). C. W. Wilmsen. Thin Solid Films 39, 105 (1976). C. J. Dell'Oca, D. L. Pulfrey, and L. Young, Phys. Thin Films 6, l (1971). J. F. O'Hanlon, J. Vac. Sci. Techno]. 7, 330, (1970). J. F. O'Hanlon, in ...
Page 7
... Electrochem. Soc., Princeton. N.J., p. 587 (1976). R. J. Ryan, E. B. Davidson, and H. 0. Hook, in “Handbook of Materials and Processes for Electronics“ (C. Harper, ed.), Ch. 14. McGraw-Hill, New York, 1970. F. H. Dill, IEEE Trans ...
... Electrochem. Soc., Princeton. N.J., p. 587 (1976). R. J. Ryan, E. B. Davidson, and H. 0. Hook, in “Handbook of Materials and Processes for Electronics“ (C. Harper, ed.), Ch. 14. McGraw-Hill, New York, 1970. F. H. Dill, IEEE Trans ...
Page 63
... Electrochem. Technol. 2, 295 (1964). D. M. Mattox, J. Vac. Sci. Technol. 10, 47 (1973). R. E. Bunshah and A. C. Raghuram, J. Vac. Sci. Technol. 9, I385 (1972). O. Almen and G. Bruce, Nucl. Instrum. Methods 11, 257 (1961). O. Almen and G ...
... Electrochem. Technol. 2, 295 (1964). D. M. Mattox, J. Vac. Sci. Technol. 10, 47 (1973). R. E. Bunshah and A. C. Raghuram, J. Vac. Sci. Technol. 9, I385 (1972). O. Almen and G. Bruce, Nucl. Instrum. Methods 11, 257 (1961). O. Almen and G ...
Page 64
... Electrochem. Soc. 115, 974 (1968). K. E. Manchester. J. Electrochem. Soc. 115, 656 (1968). J. F. Gibbons. Proc. IEEE 56, 295 (1968). W. Brandt, Sci. Am. 218(3). 90 (1968). E. Gillam. J. Phys. Chem. Solids 11, 55 (1959). D. B. Dove ...
... Electrochem. Soc. 115, 974 (1968). K. E. Manchester. J. Electrochem. Soc. 115, 656 (1968). J. F. Gibbons. Proc. IEEE 56, 295 (1968). W. Brandt, Sci. Am. 218(3). 90 (1968). E. Gillam. J. Phys. Chem. Solids 11, 55 (1959). D. B. Dove ...
Page 67
... Electrochem. Technol. 2, 5 (I964). Granger and C. R. D. Priestland, Vacuum 21, 309 (1971). C. H. George, J. Vac. Sci. Technol. 10, 393 (1973). H. J. Glaser and H. W. Brandt. U.S. Patent 3,891,536 (1975). D. C. Carmichael, D. L. Chambers ...
... Electrochem. Technol. 2, 5 (I964). Granger and C. R. D. Priestland, Vacuum 21, 309 (1971). C. H. George, J. Vac. Sci. Technol. 10, 393 (1973). H. J. Glaser and H. W. Brandt. U.S. Patent 3,891,536 (1975). D. C. Carmichael, D. L. Chambers ...
Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York