Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page vi
... Sputtering Summary References 11-3 The Sputter and S-Gun Magnetrons David B. Fraser I. II. III. IV. V. VI. Introduction Description Operational Characteristics Bias Operation Film Deposition Conclusions References 114 Planar Magnetron ...
... Sputtering Summary References 11-3 The Sputter and S-Gun Magnetrons David B. Fraser I. II. III. IV. V. VI. Introduction Description Operational Characteristics Bias Operation Film Deposition Conclusions References 114 Planar Magnetron ...
Page 78
... sputter gun. In figures vectors are indicated by arrows over the vector quantities. use the term cylindrical-post ... sputter guns. They are discussed in Chapter II-4. The emphasis in this chapter is on cylindrical-post and cylindrical ...
... sputter gun. In figures vectors are indicated by arrows over the vector quantities. use the term cylindrical-post ... sputter guns. They are discussed in Chapter II-4. The emphasis in this chapter is on cylindrical-post and cylindrical ...
Page 79
... sputtering appears to have been achieved by Penning and Moubis using configurations 3a [32] and 3b [33]. Very active ... sputter gun described in Chapters "-3 and 114. A. Basic Glow Discharge Parameters A glow discharge plasma can be ...
... sputtering appears to have been achieved by Penning and Moubis using configurations 3a [32] and 3b [33]. Very active ... sputter gun described in Chapters "-3 and 114. A. Basic Glow Discharge Parameters A glow discharge plasma can be ...
Page 104
... . Schematic representation showing substrate location and atom reflection in a cylindrical-post magnetron sputtering system. Fig. 4. Cross-section view of the 7.5 cm Sputter-Gun electrodes. 104 JOHN A. THORNTON AND ALAN s. PENFOLD.
... . Schematic representation showing substrate location and atom reflection in a cylindrical-post magnetron sputtering system. Fig. 4. Cross-section view of the 7.5 cm Sputter-Gun electrodes. 104 JOHN A. THORNTON AND ALAN s. PENFOLD.
Page 113
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Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York