Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page vi
... Beam Deposition Concluding Comments References 76 79 90 98 99 102 107 109 l 10 115 116 117 121 126 128 128 131 134 I63 167 170 170 I75 I76 189 198 203 204 Part III CHEMICAL METHODS OF FILM DEPOSITION III-1 Deposition of vi CONTENTS.
... Beam Deposition Concluding Comments References 76 79 90 98 99 102 107 109 l 10 115 116 117 121 126 128 128 131 134 I63 167 170 170 I75 I76 189 198 203 204 Part III CHEMICAL METHODS OF FILM DEPOSITION III-1 Deposition of vi CONTENTS.
Page vii
... Chemical Reactions Deposition by Electrochemical Reactions Conclusion References III-2 Chemical Vapor Deposition of Inorganic Thin Films Werner Kern and Vladimir S. Ban I. II. III. IV. V. VI. VII. VIII. Introduction Fundamental Aspects ...
... Chemical Reactions Deposition by Electrochemical Reactions Conclusion References III-2 Chemical Vapor Deposition of Inorganic Thin Films Werner Kern and Vladimir S. Ban I. II. III. IV. V. VI. VII. VIII. Introduction Fundamental Aspects ...
Page viii
John L. Vossen. Part V ETCHING PROCESSES V-l Chemical Etching Werner Kern and Cheryl A. Deckert I. II. III. IV. V. Introduction Principles and Techniques of Etching Chemical Etching of Specific Materials Tables of Etchants and Etching ...
John L. Vossen. Part V ETCHING PROCESSES V-l Chemical Etching Werner Kern and Cheryl A. Deckert I. II. III. IV. V. Introduction Principles and Techniques of Etching Chemical Etching of Specific Materials Tables of Etchants and Etching ...
Page 3
... chemical methods of film deposition, (3) hybrid (i.e., physical—chemical) methods of film deposition, and (4) patterning techniques. Part II of the book deals with the mainly physical deposition processes; those selected for review are ...
... chemical methods of film deposition, (3) hybrid (i.e., physical—chemical) methods of film deposition, and (4) patterning techniques. Part II of the book deals with the mainly physical deposition processes; those selected for review are ...
Page 4
... chemical include chemical vapor deposition and deposition of inorganic or metal films from solution by plating, anodization, etc. These processes will be found in Part 111. Hybrid processes (as defined here) are those which use glow ...
... chemical include chemical vapor deposition and deposition of inorganic or metal films from solution by plating, anodization, etc. These processes will be found in Part 111. Hybrid processes (as defined here) are those which use glow ...
Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York