Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
From inside the book
Results 1-5 of 67
Page vi
... Coating Deposition Reactive Sputtering Summary References 11-3 The Sputter and S-Gun Magnetrons David B. Fraser I. II. III. IV. V. VI. Introduction Description Operational Characteristics Bias Operation Film Deposition Conclusions ...
... Coating Deposition Reactive Sputtering Summary References 11-3 The Sputter and S-Gun Magnetrons David B. Fraser I. II. III. IV. V. VI. Introduction Description Operational Characteristics Bias Operation Film Deposition Conclusions ...
Page 4
... coating [58] 3. Chemical vapor depo- [7—11] 22. Diffusion coating [32, 59, 60] sition for epitaxy 23. Pack cementation [59] 4. Thermal oxidation [12-17] 24. Cladding [32. 61] 5. Plasma anodization ll8-20] 25. Explosive cladding [62] 6 ...
... coating [58] 3. Chemical vapor depo- [7—11] 22. Diffusion coating [32, 59, 60] sition for epitaxy 23. Pack cementation [59] 4. Thermal oxidation [12-17] 24. Cladding [32. 61] 5. Plasma anodization ll8-20] 25. Explosive cladding [62] 6 ...
Page 6
... Coating“ (B. N. Chapman and J. C. Anderson. eds.), p. 52. Academic Press, New York, 1974. J. J. Licari, “Plastic Coatings for Electronics.“ McGraw-Hill, New York, 1970. J. J. Licari and E. R. Brands, in “Handbook of Materials and ...
... Coating“ (B. N. Chapman and J. C. Anderson. eds.), p. 52. Academic Press, New York, 1974. J. J. Licari, “Plastic Coatings for Electronics.“ McGraw-Hill, New York, 1970. J. J. Licari and E. R. Brands, in “Handbook of Materials and ...
Page 7
... Coating" (B. N. Chapman and J. C. Anderson, eds.), p. 287. Academic Press, New York, 1974. D. R. Marantz, in “Science and Technology of Surface Coating" (B. N. Chapman and J. C. Anderson, eds.), p. 308. Academic Press, New York, 1974 ...
... Coating" (B. N. Chapman and J. C. Anderson, eds.), p. 287. Academic Press, New York, 1974. D. R. Marantz, in “Science and Technology of Surface Coating" (B. N. Chapman and J. C. Anderson, eds.), p. 308. Academic Press, New York, 1974 ...
Page 45
... coating of the inside walls of through holes in substrates [252], and in enabling one to cover severe substrate topographic features by bias sputtering. In general, all of these effects and their implications to film—substrate ...
... coating of the inside walls of through holes in substrates [252], and in enabling one to cover severe substrate topographic features by bias sputtering. In general, all of these effects and their implications to film—substrate ...
Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
Other editions - View all
Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York