Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
From inside the book
Results 1-5 of 89
Page 3
... electric and magnetic fields to produce high ion densities and high deposition rates with minimal substrate bOmbardment. Chapter II-2 describes cylindrical magnetrons in which the magnetic field is uniformly orthogonal to the electric ...
... electric and magnetic fields to produce high ion densities and high deposition rates with minimal substrate bOmbardment. Chapter II-2 describes cylindrical magnetrons in which the magnetic field is uniformly orthogonal to the electric ...
Page 4
... Electric harmonic I34] 31. Optical lithography [71—76] spraying 32. X-ray lithography [71, 72. 76, 77] 13. Molten-metal dip [32] 33. Electron beam [71, 72, 75, 76] coating lithography 14. Liquid-phase epitaxy [35—40] pattern delineation ...
... Electric harmonic I34] 31. Optical lithography [71—76] spraying 32. X-ray lithography [71, 72. 76, 77] 13. Molten-metal dip [32] 33. Electron beam [71, 72, 75, 76] coating lithography 14. Liquid-phase epitaxy [35—40] pattern delineation ...
Page 28
... electrical conductors since rf voltages can be coupled through any kind of impedance. Thus, it is literally possible to sputter anything. However. this does not imply that the films deposited will necessarily resemble the target ...
... electrical conductors since rf voltages can be coupled through any kind of impedance. Thus, it is literally possible to sputter anything. However. this does not imply that the films deposited will necessarily resemble the target ...
Page 31
... electrical isolation and contact, ground shielding, and materials of construction. A versatile assembly suitable for research is shown in Fig. 8. Several multitarget arrangements have been described which are useful in sequential ...
... electrical isolation and contact, ground shielding, and materials of construction. A versatile assembly suitable for research is shown in Fig. 8. Several multitarget arrangements have been described which are useful in sequential ...
Page 32
... Electrical Isolation and Contacts Isolation of the target assembly from grounded parts of the system usually involves a ceramic-to-metal seal with a sufficiently thick ceramic to minimize capacitive losses. Water lines must be isolated ...
... Electrical Isolation and Contacts Isolation of the target assembly from grounded parts of the system usually involves a ceramic-to-metal seal with a sufficiently thick ceramic to minimize capacitive losses. Water lines must be isolated ...
Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
Other editions - View all
Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York