Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page iv
... L. II. Kern, Werner, Date TK787].15.F5T43 621.381'73 78—3348 ISBN 0—12—728250—5 PRINTED IN THE UNITED STATES OF AMERICA Characteristic Aspects of Glow Discharge Polymerization Processing Factors of Glow Copyright Page.
... L. II. Kern, Werner, Date TK787].15.F5T43 621.381'73 78—3348 ISBN 0—12—728250—5 PRINTED IN THE UNITED STATES OF AMERICA Characteristic Aspects of Glow Discharge Polymerization Processing Factors of Glow Copyright Page.
Page vii
... Glow Discharge Polymerization H. Yasuda I. II. III. IV, V. Introduction 209 210 229 254 255 258 259 278 309 315 3l7 ... Glow Discharge Polymerization Processing Factors of Glow Discharge Polymerization Organic Compounds for Glow ...
... Glow Discharge Polymerization H. Yasuda I. II. III. IV, V. Introduction 209 210 229 254 255 258 259 278 309 315 3l7 ... Glow Discharge Polymerization Processing Factors of Glow Discharge Polymerization Organic Compounds for Glow ...
Page 4
... glow discharge, but are in a relatively good vacuum. Not only are the important consequences of this covered, but ... polymerization of monomers in a glow discharge. Part V covers etching techniques for films and substrates. Etching for ...
... glow discharge, but are in a relatively good vacuum. Not only are the important consequences of this covered, but ... polymerization of monomers in a glow discharge. Part V covers etching techniques for films and substrates. Etching for ...
Page 360
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Page 361
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Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York