Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 4
... plating, anodization, etc. These processes will be found in Part 111. Hybrid processes (as defined here) are those which use glow discharges to activate chemical deposition processes. Chapter IV-l discusses plasma deposition—the ...
... plating, anodization, etc. These processes will be found in Part 111. Hybrid processes (as defined here) are those which use glow discharges to activate chemical deposition processes. Chapter IV-l discusses plasma deposition—the ...
Page 11
... Plating . Scale-Up Problems V. Preconditioning of Targets, Substrates, and Systems for Film Deposition A. Target Materials 12 14 14 16 20 20 21 22 23 24 24 27 27 29 31 3] 33 36 37 39 39 39 40 41 41 Copyright © 1978 by Academic Press ...
... Plating . Scale-Up Problems V. Preconditioning of Targets, Substrates, and Systems for Film Deposition A. Target Materials 12 14 14 16 20 20 21 22 23 24 24 27 27 29 31 3] 33 36 37 39 39 39 40 41 41 Copyright © 1978 by Academic Press ...
Page 13
... plating. Initially, the term “ion plating“ referred to a process in which the deposition source was a thermal evaporation filament instead of a sputtering target and the substrates were connected to a dc sputtering target [16], but it ...
... plating. Initially, the term “ion plating“ referred to a process in which the deposition source was a thermal evaporation filament instead of a sputtering target and the substrates were connected to a dc sputtering target [16], but it ...
Page 31
... plating systems to increase the ionization efficiency at low gas pressure [138]. The evaporant passes through the coil in transit to substrates attached to a dc sputtering target. This increases the level of ionization of both the ...
... plating systems to increase the ionization efficiency at low gas pressure [138]. The evaporant passes through the coil in transit to substrates attached to a dc sputtering target. This increases the level of ionization of both the ...
Page 33
... plated for corrosion protection and is difficult to machine, but it is a good choice. Aluminum, unless it is perfectly protected from corrosion in the presence of water, is a very poor choice. B. Power Supplies 1. DC There are many ...
... plated for corrosion protection and is difficult to machine, but it is a good choice. Aluminum, unless it is perfectly protected from corrosion in the presence of water, is a very poor choice. B. Power Supplies 1. DC There are many ...
Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York