Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 14
... reaction, bulk diffusion, crystallographic changes, and reflection of some of the emitted particles back to the bombarded surface (backseattering). It should be noted that all of these same phenomena apply to sputter-etching processes ...
... reaction, bulk diffusion, crystallographic changes, and reflection of some of the emitted particles back to the bombarded surface (backseattering). It should be noted that all of these same phenomena apply to sputter-etching processes ...
Page 23
... reaction of an excited neutral or ionized gas with a surface to form volatile compounds [1, 111, 112]. This ... reactions can occur. Etching of glass substrates, rather than film deposition, has been observed during “sputter deposition ...
... reaction of an excited neutral or ionized gas with a surface to form volatile compounds [1, 111, 112]. This ... reactions can occur. Etching of glass substrates, rather than film deposition, has been observed during “sputter deposition ...
Page 49
... Reactions in the gas phase can for the most part be ruled out for much the same reasons that ions cannot be neutralized ... reaction to occur at a surface—either the target or the substrate. At very low reactive gas partial pressure and ...
... Reactions in the gas phase can for the most part be ruled out for much the same reasons that ions cannot be neutralized ... reaction to occur at a surface—either the target or the substrate. At very low reactive gas partial pressure and ...
Page 197
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Page 210
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Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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Common terms and phrases
A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York