Thin Film ProcessesRemarkable advances have been made in recent years in the science and technology of thin film processes for deposition and etching. It is the purpose of this book to bring together tutorial reviews of selected filmdeposition and etching processes from a process viewpoint. Emphasis is placed on the practical use of the processes to provide working guidelines for their implementation, a guide to the literature, and an overview of each process. |
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Page 11
... Sputtering Yield . Emission of Other Particles Emission of Radiation . Ion Implantation Altered Surface Layers and Diffusion Dissociation Processes Chemical Sputtering ow Discharges DC Glow Discharges Low-Frequency AC Glow Discharges RF ...
... Sputtering Yield . Emission of Other Particles Emission of Radiation . Ion Implantation Altered Surface Layers and Diffusion Dissociation Processes Chemical Sputtering ow Discharges DC Glow Discharges Low-Frequency AC Glow Discharges RF ...
Page 14
... sputtering is more properly related to ion etching processes (see Chapter V-2). We shall consider in detail the ... Yield The sputtering yield is defined as the number of atoms ejected from a target surface per incident ion. It is the ...
... sputtering is more properly related to ion etching processes (see Chapter V-2). We shall consider in detail the ... Yield The sputtering yield is defined as the number of atoms ejected from a target surface per incident ion. It is the ...
Page 15
... sputtering yield determines the erosion rate of sputtering targets; and largely, but not completely, determines the deposition rate of sputtered films. Several compilations of experimental sputtering yield and related data have been ...
... sputtering yield determines the erosion rate of sputtering targets; and largely, but not completely, determines the deposition rate of sputtered films. Several compilations of experimental sputtering yield and related data have been ...
Page 16
... sputtering yields Of pure metals [21]. A11 target materials are polycrystalline unless otherwise indicated. B ... Yield of Elements at I keV Gas He. 16 J. L. VOSSEN AND J. .I. CUOMO.
... sputtering yields Of pure metals [21]. A11 target materials are polycrystalline unless otherwise indicated. B ... Yield of Elements at I keV Gas He. 16 J. L. VOSSEN AND J. .I. CUOMO.
Page 17
John L. Vossen. Table II Sputtering Yield of Elements at I keV Gas He N Ne N2 Ar Kr Xe Reference Element Fe — — 0.85 ... Yields Material Gas Energy (keV) Yield. u-l. GLOW DISCHARGE SPUTTER DEPOSITION 17.
John L. Vossen. Table II Sputtering Yield of Elements at I keV Gas He N Ne N2 Ar Kr Xe Reference Element Fe — — 0.85 ... Yields Material Gas Energy (keV) Yield. u-l. GLOW DISCHARGE SPUTTER DEPOSITION 17.
Contents
9 | |
Chemical Methods of Film Deposition | 207 |
Physicalchemical Methods of Film Deposition | 333 |
Etching Processes | 399 |
Index | 557 |
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A/min Abstr alloys anode Appl argon atoms cathode Chem chemical Chemical vapor deposition coatings composition compounds configuration current density deposition rate effect efficiency electric Electrochem electron electroplating energy Epitaxial etch rate etchants etching processes film deposition first flow rate flux GaAs gas flow gases glow discharge polymerization heat increase ion beam deposition ion etching ionization Kern layer magnetic field magnetron mask metal mTorr nitride oxide photoresist Phys planar plasma etching plating PM sputtering pm/min polishing polymer polymer deposition potential pressure Proc produce profile ratio RCA Rev reaction reactive reactive sputtering reactor reflected Semiconductors shown in Fig SiH4 silicon silicon nitride SiO2 solution species sputter deposition sputter etching Sputter Gun sputtering yield starting material stoichiometry substrate sufficient susceptor techniques Technol temperature thermal thickness thin film Thin Solid Films tion U.S. Patent uniform vacuum vapor voltage wafer York