Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 49
... ( BEOL ) Integration J. J. Yang , J. Gill , J. Kennedy , S.-Q. Wang , L. Forester and M. Ross * AlliedSignal Inc. , Advanced Microelectronics Materials , 1349 Moffett Park Drive , Sunnyvale , CA 94089 * AlliedSignal Inc. , Electron Vision ...
... ( BEOL ) Integration J. J. Yang , J. Gill , J. Kennedy , S.-Q. Wang , L. Forester and M. Ross * AlliedSignal Inc. , Advanced Microelectronics Materials , 1349 Moffett Park Drive , Sunnyvale , CA 94089 * AlliedSignal Inc. , Electron Vision ...
Page 133
... ( BEOL ) interconnect performance . One critical dimension for successful integration of these new materials is maintaining mechanical integrity through multilayer processes . This includes both cohesive and adhesive fracture resistance ...
... ( BEOL ) interconnect performance . One critical dimension for successful integration of these new materials is maintaining mechanical integrity through multilayer processes . This includes both cohesive and adhesive fracture resistance ...
Page 137
... BEOL processes . The adhesion results show how processing conditions can impact the critical strain energy release rate of the build . For example , H2 plasma treatments severely degrade the adhesion of CVD Al to BCB . The failed ...
... BEOL processes . The adhesion results show how processing conditions can impact the critical strain energy release rate of the build . For example , H2 plasma treatments severely degrade the adhesion of CVD Al to BCB . The failed ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films