Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page iv
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance ... Materials Research Society Symposium Proceedings ... PART.
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance ... Materials Research Society Symposium Proceedings ... PART.
Page xii
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 481- Phase Transformation and Systems Driven Far From Equilibrium ... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 508— Flat - Panel Materials Research Society Symposium Proceedings.
MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 481- Phase Transformation and Systems Driven Far From Equilibrium ... RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS Volume 508— Flat - Panel Materials Research Society Symposium Proceedings.
Page 131
... Material Analysis , edited by M. Natasi , Materials Research Society , Pittsburgh ( 1995 ) . 3. H. Bakhru , Encyclopedia of Material Science and Engineering , Edited by Michael B. , Bever , Peragamon Press 1990 , pp . 2402-2407 . 4 ...
... Material Analysis , edited by M. Natasi , Materials Research Society , Pittsburgh ( 1995 ) . 3. H. Bakhru , Encyclopedia of Material Science and Engineering , Edited by Michael B. , Bever , Peragamon Press 1990 , pp . 2402-2407 . 4 ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films