Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 26
50. J. J. Pireaux , C. Grégoire , M. Vermeersch , P. A. Thiry , M. R. Vilar and R ... P. A. Thiry , R. Caudano and T. C. Clarke , J. Chem . Phys . 88 , 3353 ... N. Marin , Y. Serruys and P. Calmon , Nuclear Instr . and Methods in Physics ...
50. J. J. Pireaux , C. Grégoire , M. Vermeersch , P. A. Thiry , M. R. Vilar and R ... P. A. Thiry , R. Caudano and T. C. Clarke , J. Chem . Phys . 88 , 3353 ... N. Marin , Y. Serruys and P. Calmon , Nuclear Instr . and Methods in Physics ...
Page 285
Table II Comparison between the high - quality PA - N film and the low - quality film The XPS result of PA - N film before and after CMP treatment Sample Condition High quality sample Poor quality sample C and Cls at peak area ( % ) As ...
Table II Comparison between the high - quality PA - N film and the low - quality film The XPS result of PA - N film before and after CMP treatment Sample Condition High quality sample Poor quality sample C and Cls at peak area ( % ) As ...
Page 339
... PA , 1995 ) pp . 91-96 . 6. S.M. weiderhorn , J. Amer . Cera . Soc . , 59 , 407 , 1967 . 7. D.D. Denton , D.R. Day , D.F. Priore and S.D. Senturia , " Moisture diffusion in polyimide films in IC , " J. Electronic Materials , Vol . 14 ...
... PA , 1995 ) pp . 91-96 . 6. S.M. weiderhorn , J. Amer . Cera . Soc . , 59 , 407 , 1967 . 7. D.D. Denton , D.R. Day , D.F. Priore and S.D. Senturia , " Moisture diffusion in polyimide films in IC , " J. Electronic Materials , Vol . 14 ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films