Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page iv
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance Center , Salem , Massachusetts . Published by : Materials ...
... Research Society . All rights reserved . This book has been registered with Copyright Clearance Center , Inc. For further information , please contact the Copyright Clearance Center , Salem , Massachusetts . Published by : Materials ...
Page 39
... Research Center , 650 Harry Road , San Jose , CA 95120-6099 Cattien V. Nguyen Eloret / Thermal Science Institute , 690 W. Fremont , Sunnyvale , CA 94087 Jie Han , and Richard L. Jaffe NASA Ames Research Center , Moffett Field , CA 94035 ...
... Research Center , 650 Harry Road , San Jose , CA 95120-6099 Cattien V. Nguyen Eloret / Thermal Science Institute , 690 W. Fremont , Sunnyvale , CA 94087 Jie Han , and Richard L. Jaffe NASA Ames Research Center , Moffett Field , CA 94035 ...
Page 84
... Research , Lucent Technologies Bell Laboratories Graduate Research Program for Women , DuPont , and the NSF / SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing . We would also like to thank Helen ...
... Research , Lucent Technologies Bell Laboratories Graduate Research Program for Women , DuPont , and the NSF / SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing . We would also like to thank Helen ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films