Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 27
... SiO2 films . Incorporation of methyl - groups into the Si - O network is one of promising ways for reducing the K value , and Si - compounds having methyl - groups seem the most popular source material for such organic silica film ...
... SiO2 films . Incorporation of methyl - groups into the Si - O network is one of promising ways for reducing the K value , and Si - compounds having methyl - groups seem the most popular source material for such organic silica film ...
Page 63
... SiO2 films by CF4 PII using an ICP plasma reactor . The effective dielectric constant of the films was significantly reduced after PII doping . An analysis of a double layer model indicated that a high quality dielectric layer with a ...
... SiO2 films by CF4 PII using an ICP plasma reactor . The effective dielectric constant of the films was significantly reduced after PII doping . An analysis of a double layer model indicated that a high quality dielectric layer with a ...
Page 342
SiO2 ILD Low - k ILD Heat dissipation Wiring SiO2 Wiring SiO2 Figure 1. Heat ... films containing a lot of fluorine have a dielectric constant of 2.5 . The ... films ( 0.108 W / m K ) is about one order lower than that of SiO2 films ( 1.2 ...
SiO2 ILD Low - k ILD Heat dissipation Wiring SiO2 Wiring SiO2 Figure 1. Heat ... films containing a lot of fluorine have a dielectric constant of 2.5 . The ... films ( 0.108 W / m K ) is about one order lower than that of SiO2 films ( 1.2 ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films