Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 125
... analysis techniques have become very useful for characterization of low k materials . Studies on several ion beam analysis techniques will be discussed . Rutherford Backscattering Spectrometry ( RBS ) provides a very powerful analytical ...
... analysis techniques have become very useful for characterization of low k materials . Studies on several ion beam analysis techniques will be discussed . Rutherford Backscattering Spectrometry ( RBS ) provides a very powerful analytical ...
Page 127
... ANALYSIS ( NRA ) The following table shows the setup for several low z elements that can be profiled by NRA technique . These nuclear reactions have been used in the analysis of low k materials . Detected Element Reaction Incident ...
... ANALYSIS ( NRA ) The following table shows the setup for several low z elements that can be profiled by NRA technique . These nuclear reactions have been used in the analysis of low k materials . Detected Element Reaction Incident ...
Page 131
... analysis and optical techniques , AIP Conf . Proc . ( USA ) , no.392 , pt.1 , p . 697-700 8. W. Lanford , Handbook of Modern Ion Beam Material Analysis , edited by Michael Natasi , Materials Research Society 1995 , ch . 8 . 9. M ...
... analysis and optical techniques , AIP Conf . Proc . ( USA ) , no.392 , pt.1 , p . 697-700 8. W. Lanford , Handbook of Modern Ion Beam Material Analysis , edited by Michael Natasi , Materials Research Society 1995 , ch . 8 . 9. M ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films