Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page xii
... Applications of Semiconductors II , S. Sivananthan , M.O. Manasreh , R.H. Miles , D.L. McDaniel , Jr. , 1998 , ISBN : 1-55899-389-4 Volume 485- Thin - Film Structures for Photovoltaics , E.D. Jones , R. Noufi , B.L. Sopori , J. Kalejs ...
... Applications of Semiconductors II , S. Sivananthan , M.O. Manasreh , R.H. Miles , D.L. McDaniel , Jr. , 1998 , ISBN : 1-55899-389-4 Volume 485- Thin - Film Structures for Photovoltaics , E.D. Jones , R. Noufi , B.L. Sopori , J. Kalejs ...
Page 24
... Applications , edited by C. P. Wong ( Academic Press , Boston , 1993 ) . 2. Polyimides : Fundamental Aspects and Technological Applications , edited by M. Ghosh and K. L. Mittal ( Marcel Dekker , New York , 1996 ) . 3. M. T. Bohr , IEEE ...
... Applications , edited by C. P. Wong ( Academic Press , Boston , 1993 ) . 2. Polyimides : Fundamental Aspects and Technological Applications , edited by M. Ghosh and K. L. Mittal ( Marcel Dekker , New York , 1996 ) . 3. M. T. Bohr , IEEE ...
Page 55
... Applications in 1996 , MRS , p.505 ( 1997 ) . 4. J. J. Yang , et al . , Proceedings of Advanced Metalization and Interconnect Systems for ULSI Applications in 1997 , MRS , p.359 ( 1998 ) . 5. W. R. Liversay , J. Vac . Sci . & Tech . , B ...
... Applications in 1996 , MRS , p.505 ( 1997 ) . 4. J. J. Yang , et al . , Proceedings of Advanced Metalization and Interconnect Systems for ULSI Applications in 1997 , MRS , p.359 ( 1998 ) . 5. W. R. Liversay , J. Vac . Sci . & Tech . , B ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films