Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 171
... rate model is used to predict crack velocity using a deleted - bond model ... corrosion cracking characteristics . On application of a crack driving force ... corrosion cracking must be minimized . The dielectric properties of SSQ SOG ...
... rate model is used to predict crack velocity using a deleted - bond model ... corrosion cracking characteristics . On application of a crack driving force ... corrosion cracking must be minimized . The dielectric properties of SSQ SOG ...
Page 330
... corrosion due to moisture or other chemical species . The moisture related ... rate controls the kinetics which is strongly dependent on stress at the tip ... Rate , G ( J / m2 ) Figure 2. Three principal regions , I , II and III , of ...
... corrosion due to moisture or other chemical species . The moisture related ... rate controls the kinetics which is strongly dependent on stress at the tip ... Rate , G ( J / m2 ) Figure 2. Three principal regions , I , II and III , of ...
Page 335
... corrosion . 35 30 25 20 15 10 5 Load relaxation at fixed displacement . Interface crack propagation increased the compliance of beam . The rate of load drop slowed down with decrease of load indicating deceleration of crack velocity ...
... corrosion . 35 30 25 20 15 10 5 Load relaxation at fixed displacement . Interface crack propagation increased the compliance of beam . The rate of load drop slowed down with decrease of load indicating deceleration of crack velocity ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films