Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 4
... cost . Design solutions may be augmented by the use of new interconnect materials such as copper metallization and / or dielectrics with lower permittivity ( low k ) . Due to the lower resistivity of copper as compared with traditional ...
... cost . Design solutions may be augmented by the use of new interconnect materials such as copper metallization and / or dielectrics with lower permittivity ( low k ) . Due to the lower resistivity of copper as compared with traditional ...
Page 64
... cost , uniform doping for non - planar samples , and co - implantation of multiple species . These characteristics make PII a suitable low - cost technique for large area processing and synthesis of new materials . In this paper , the ...
... cost , uniform doping for non - planar samples , and co - implantation of multiple species . These characteristics make PII a suitable low - cost technique for large area processing and synthesis of new materials . In this paper , the ...
Page 210
... cost in increased capacitance will be acceptable . Nonetheless , the improvements in low к materials will allow manufacturers more freedom in their utilization , such as the implementation of unlanded vias . ACKNOWLEDGEMENTS The author ...
... cost in increased capacitance will be acceptable . Nonetheless , the improvements in low к materials will allow manufacturers more freedom in their utilization , such as the implementation of unlanded vias . ACKNOWLEDGEMENTS The author ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines Microelectronics modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films