Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 174
... Crack Driving Force , G ( J m2 ) Figure 2. Plot of crack velocity vs. crack driving force for SSQ SOG materials . Solid lines represent predicted responses using SiO2 bonds as a basis and indicated increased bond separations . The ...
... Crack Driving Force , G ( J m2 ) Figure 2. Plot of crack velocity vs. crack driving force for SSQ SOG materials . Solid lines represent predicted responses using SiO2 bonds as a basis and indicated increased bond separations . The ...
Page 175
... Crack Driving Force , G ( J m2 ) Figure 3. Plot of crack velocity vs crack driving force for SSQ SOG materials cured with different time - temperature conditions : longer curing times and greater curing temperatures lead to films with ...
... Crack Driving Force , G ( J m2 ) Figure 3. Plot of crack velocity vs crack driving force for SSQ SOG materials cured with different time - temperature conditions : longer curing times and greater curing temperatures lead to films with ...
Page 336
... crack velocity as a function of load . Plotted in Fig . 10 is the crack velocity of several dry samples tested in wet air . Because the crack length was limited by the beam size , several samples were needed to cover the range of load ...
... crack velocity as a function of load . Plotted in Fig . 10 is the crack velocity of several dry samples tested in wet air . Because the crack length was limited by the beam size , several samples were needed to cover the range of load ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films