Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 234
... density and thickness using a Philips X'Pert MRD Diffractometer . The dielectric constant k is determined from C - V measurement ( 1 MHz ) on Al - dot / a - F : C / TiN capacitors . In order to determine k accurately , we have measured ...
... density and thickness using a Philips X'Pert MRD Diffractometer . The dielectric constant k is determined from C - V measurement ( 1 MHz ) on Al - dot / a - F : C / TiN capacitors . In order to determine k accurately , we have measured ...
Page 254
... density and dielectric constant changes in the films with depth and to investigate the composition profile and surface chemistry of etched films . EXPERIMENTAL HSQ films with a thickness of about 1.05 μm on bare silicon wafers were ...
... density and dielectric constant changes in the films with depth and to investigate the composition profile and surface chemistry of etched films . EXPERIMENTAL HSQ films with a thickness of about 1.05 μm on bare silicon wafers were ...
Page 265
... density plasma ( HDP ) systems . The plasma generation in these systems is very efficient and ion densities ( ~ 102 cm3 ) can be achieved up to a hundred times higher than in conventional reactive ion etching ( RIE ) tools ( ~ 101o cm3 ) ...
... density plasma ( HDP ) systems . The plasma generation in these systems is very efficient and ion densities ( ~ 102 cm3 ) can be achieved up to a hundred times higher than in conventional reactive ion etching ( RIE ) tools ( ~ 101o cm3 ) ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films