Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 99
... developed for bulk aerogels . Diffusion of copper is orders of magnitude faster in these xerogels than in the corresponding thermal oxide . An activation energy of 0.9 eV was estimated based on a convective diffusion model ...
... developed for bulk aerogels . Diffusion of copper is orders of magnitude faster in these xerogels than in the corresponding thermal oxide . An activation energy of 0.9 eV was estimated based on a convective diffusion model ...
Page 151
... developed on - wafer photothermal measurement . To study thermal anisotropy , the out - of - plane thermal diffusivity measured from this technique is compared with the in - plane thermal diffusivity by measured by ISTS [ 1 ] . In ...
... developed on - wafer photothermal measurement . To study thermal anisotropy , the out - of - plane thermal diffusivity measured from this technique is compared with the in - plane thermal diffusivity by measured by ISTS [ 1 ] . In ...
Page 202
... developed and tested for use as low к interlevel dielectrics to date may be divided into three classes : spin - on or CVD organic films , PECVD deposited amorphous or polymeric films from organic precursors , and modified glasses ...
... developed and tested for use as low к interlevel dielectrics to date may be divided into three classes : spin - on or CVD organic films , PECVD deposited amorphous or polymeric films from organic precursors , and modified glasses ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films