Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
From inside the book
Results 1-3 of 78
Page vi
... Dielectric Constant Materials ... Licheng M. Han , Richard B. Timmons , and Wei W. Lee Fabrication and Characterization of Spin - On Silica Xerogel Films ... ..... S. Nitta , A. Jain , V. Pisupatti , W.N. Gill , P.C. Wayner , Jr. , and ...
... Dielectric Constant Materials ... Licheng M. Han , Richard B. Timmons , and Wei W. Lee Fabrication and Characterization of Spin - On Silica Xerogel Films ... ..... S. Nitta , A. Jain , V. Pisupatti , W.N. Gill , P.C. Wayner , Jr. , and ...
Page 133
ADHESION ENERGY MEASUREMENTS OF MULTILAYER LOW - K DIELECTRIC MATERIALS FOR ULSI APPLICATIONS E. O. SHAFFER II * , M. E. MILLS * , D. HAWN * , M. VAN GESTEL ** , A. KNORR ** , H. GUNDLACH ” , K. KUMAR * , A. E. KALOYEROS ** AND R. E. ...
ADHESION ENERGY MEASUREMENTS OF MULTILAYER LOW - K DIELECTRIC MATERIALS FOR ULSI APPLICATIONS E. O. SHAFFER II * , M. E. MILLS * , D. HAWN * , M. VAN GESTEL ** , A. KNORR ** , H. GUNDLACH ” , K. KUMAR * , A. E. KALOYEROS ** AND R. E. ...
Page 241
... Materials Research Society process has the following attribute ( i ) low processing 241 Process Integration Issues for Interlevel Dielectric Materials for Sub-Quarter Micron Silicon Integrated Circuits Vijay Parihar and R Singh.
... Materials Research Society process has the following attribute ( i ) low processing 241 Process Integration Issues for Interlevel Dielectric Materials for Sub-Quarter Micron Silicon Integrated Circuits Vijay Parihar and R Singh.
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
41 other sections not shown
Other editions - View all
Common terms and phrases
1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films