Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 50
... e - beam exposure . The electron beam dose is the amount of electrons applied to the target material . This parameter effects the overall degree of e - beam curing for a given polymer . The beam ... E - BEAM CURING FOR SPIN - ON 50 50.
... e - beam exposure . The electron beam dose is the amount of electrons applied to the target material . This parameter effects the overall degree of e - beam curing for a given polymer . The beam ... E - BEAM CURING FOR SPIN - ON 50 50.
Page 51
... e - beam irradiation can greatly improve properties of spin - on polymers such as thermal stability , resistance to ... e - beam irradiation approach [ 4 ] . In both cases , the e - beam modified surface layer protected the underlying ...
... e - beam irradiation can greatly improve properties of spin - on polymers such as thermal stability , resistance to ... e - beam irradiation approach [ 4 ] . In both cases , the e - beam modified surface layer protected the underlying ...
Page 52
... e - beam cure , variable energy e - beam cure , and depth - controlled e - beam cure . The full e - beam curing process results in a constant wet etching rate throughout the entire thickness of the film , indicating the homogeneity of ...
... e - beam cure , variable energy e - beam cure , and depth - controlled e - beam cure . The full e - beam curing process results in a constant wet etching rate throughout the entire thickness of the film , indicating the homogeneity of ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films