Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 63
... Electrical and Computer Engineering , Northeastern University , Boston , MA 02115 ** Dept . of Physics and Materials Science , City University of Hong Kong , 83 Tat Chee Avenue , Kowloon , Hong Kong ABSTRACT Plasma ion implantation ...
... Electrical and Computer Engineering , Northeastern University , Boston , MA 02115 ** Dept . of Physics and Materials Science , City University of Hong Kong , 83 Tat Chee Avenue , Kowloon , Hong Kong ABSTRACT Plasma ion implantation ...
Page 121
... electric field parallel to the channels ( perpendicular to the face of the GCA ) , then with the electric field ... Electrical Transport and Optical Properties of Inhomogeneous Media " edited by J.C. Garland and D.B. Tanner ( AIP ...
... electric field parallel to the channels ( perpendicular to the face of the GCA ) , then with the electric field ... Electrical Transport and Optical Properties of Inhomogeneous Media " edited by J.C. Garland and D.B. Tanner ( AIP ...
Page 320
... ELECTRICAL TESTING The test setup is shown in Figure 4. The setup consists of a probe station situated inside a sealed plexiglas TM enclosure which is continuously purged with N2 to displace O2 and moisture . The probe station contains ...
... ELECTRICAL TESTING The test setup is shown in Figure 4. The setup consists of a probe station situated inside a sealed plexiglas TM enclosure which is continuously purged with N2 to displace O2 and moisture . The probe station contains ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films