Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 309
... electromigration driving force was measured using either an optical microscope or a scanning electron microscope . Line Section Reservoir Polyimide Polyimide M3 SiN SiO2 M2 Cu Cu M2 Cu Si3N4 Cu Liner Polyimide Polyimide M1 Cu Liner ...
... electromigration driving force was measured using either an optical microscope or a scanning electron microscope . Line Section Reservoir Polyimide Polyimide M3 SiN SiO2 M2 Cu Cu M2 Cu Si3N4 Cu Liner Polyimide Polyimide M1 Cu Liner ...
Page 354
... electromigration performance . EXPERIMENTAL PROCEDURE The samples used for this study were fabricated by SEMATECH and consisted of single - level 800 μm long , stripe EM test structures . Two adjacent extrusion monitor lines were ...
... electromigration performance . EXPERIMENTAL PROCEDURE The samples used for this study were fabricated by SEMATECH and consisted of single - level 800 μm long , stripe EM test structures . Two adjacent extrusion monitor lines were ...
Page 356
... electromigration testing current densities . TEOS PAE ΔΤ ( ° C ) at 1E6 A / cm2 01 . 1.7 AT ( ° C ) 0.98 at 2E6 A / cm2 0.5 7.4 0 2 4 6 8 10 12 14 16 18 Current ( mA ) ΔΤ ( ° C ) at 3E6 A / cm2 3.0 18.5 Figure 2. Normalized Al line ...
... electromigration testing current densities . TEOS PAE ΔΤ ( ° C ) at 1E6 A / cm2 01 . 1.7 AT ( ° C ) 0.98 at 2E6 A / cm2 0.5 7.4 0 2 4 6 8 10 12 14 16 18 Current ( mA ) ΔΤ ( ° C ) at 3E6 A / cm2 3.0 18.5 Figure 2. Normalized Al line ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films