Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 40
... exhibits a constant dielectric value at all temperatures . Both MSQ and PSQ , however , exhibit a different type of temperature dependence , namely a decrease in the dielectric constant with increasing temperature . The origin of these ...
... exhibits a constant dielectric value at all temperatures . Both MSQ and PSQ , however , exhibit a different type of temperature dependence , namely a decrease in the dielectric constant with increasing temperature . The origin of these ...
Page 139
... exhibit a high thermal stability due to the relatively high back - end - of - line ( BEOL ) processing temperature . The polymers which exhibit high thermal stability often contain a main- chain benzene ring . Since benzene has a high ...
... exhibit a high thermal stability due to the relatively high back - end - of - line ( BEOL ) processing temperature . The polymers which exhibit high thermal stability often contain a main- chain benzene ring . Since benzene has a high ...
Page 144
... exhibit dielectric anisotropy . The work here showed PPXN and VT - 4 exhibit a large negative birefringence causing a high in - plane capacitance not desirable for reducing cross - talk , power consumption , or interconnect delay in ...
... exhibit dielectric anisotropy . The work here showed PPXN and VT - 4 exhibit a large negative birefringence causing a high in - plane capacitance not desirable for reducing cross - talk , power consumption , or interconnect delay in ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines Microelectronics modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films