Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 64
... experiments . It consists of a chamber with a multipolar magnetic confinement structure , an electrical system to ... experiment are : plasma density i≈ 1011 / cm3 , electron temperature T. ≈ 4 eV , and plasma potential V , ≈ 30 V. P ...
... experiments . It consists of a chamber with a multipolar magnetic confinement structure , an electrical system to ... experiment are : plasma density i≈ 1011 / cm3 , electron temperature T. ≈ 4 eV , and plasma potential V , ≈ 30 V. P ...
Page 90
... experimental data . There are slight deviations between calculated values and experimental data in lower PEI concentration region . Figure 2 shows the cloud - point curves of PEI / PAI system . This system also shows a LCST phase ...
... experimental data . There are slight deviations between calculated values and experimental data in lower PEI concentration region . Figure 2 shows the cloud - point curves of PEI / PAI system . This system also shows a LCST phase ...
Page 248
... experiments were carried out in two different conditions . One part of the experiments were carried out in a O / NF , plasma afterglow with different ratio of O , and NF , in helium ( Matrix 303 ) . The second part of the experiments ...
... experiments were carried out in two different conditions . One part of the experiments were carried out in a O / NF , plasma afterglow with different ratio of O , and NF , in helium ( Matrix 303 ) . The second part of the experiments ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films