Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 165
... fibers , the latter were grown by laser heated pedestal growth technique ( LHPG ) . All of these materials possess low dielectric constants , low losses and high Q values . In contrast to relaxor ferroelectrics , that as a rule exhibit ...
... fibers , the latter were grown by laser heated pedestal growth technique ( LHPG ) . All of these materials possess low dielectric constants , low losses and high Q values . In contrast to relaxor ferroelectrics , that as a rule exhibit ...
Page 166
... fibers doesn't show any superlattice reflections and corresponds to an ideal simple cubic perovskite structure with a = 4.0877 Å . The study of different samples has revealed the spread in the values of many important physical property ...
... fibers doesn't show any superlattice reflections and corresponds to an ideal simple cubic perovskite structure with a = 4.0877 Å . The study of different samples has revealed the spread in the values of many important physical property ...
Page 169
... fibers a simple cubic structure with disordered B - site that corresponds to a simple cubic perovskite ( Pm3m ) symmetry on the average . Comparison of the Raman spectra from both ceramics and fibers does not reveal any important ...
... fibers a simple cubic structure with disordered B - site that corresponds to a simple cubic perovskite ( Pm3m ) symmetry on the average . Comparison of the Raman spectra from both ceramics and fibers does not reveal any important ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films