Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 145
... fluorinated polymers ( fluorinated polyimide and fluorinated poly ( aryl ether ) ) , which are promising candidate as interlayer dielectrics ( ILD ) . From the measurement of the optical anisotropy , the fluorinated polyimide has larger ...
... fluorinated polymers ( fluorinated polyimide and fluorinated poly ( aryl ether ) ) , which are promising candidate as interlayer dielectrics ( ILD ) . From the measurement of the optical anisotropy , the fluorinated polyimide has larger ...
Page 149
... Fluorinated polyimide perpendicular polarized light incident on the sample oscillates parallel to the metal line ... fluorinated polymers , fluorinated polyimide and fluorinated poly ( aryl ether ) , is selected . Fluorinated polyimide ...
... Fluorinated polyimide perpendicular polarized light incident on the sample oscillates parallel to the metal line ... fluorinated polymers , fluorinated polyimide and fluorinated poly ( aryl ether ) , is selected . Fluorinated polyimide ...
Page 249
... fluorinated BCB ( SILK shows a similar behaviour ) is much less than the etch rate of the pristine films and depend on degree of fluorination ( the white triangulars ) . 1200 1200 O O2 - plasma Δ 5 s 1000 A F - plasma ( 1 ) 1000 O 800 F ...
... fluorinated BCB ( SILK shows a similar behaviour ) is much less than the etch rate of the pristine films and depend on degree of fluorination ( the white triangulars ) . 1200 1200 O O2 - plasma Δ 5 s 1000 A F - plasma ( 1 ) 1000 O 800 F ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films