Low-dielectric Constant MaterialsMaterials Research Society, 1998 - Electric insulators and insulation |
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Page 128
... Fluorine depth profile of CaF2 crystal . Figure 4. Fluorine depth profile of 1E16 fluorine implant in Si . We have characterized several fluorinated oxides [ 7 ] and polymers using NRA techniques . In the case of SiO : F thin films ...
... Fluorine depth profile of CaF2 crystal . Figure 4. Fluorine depth profile of 1E16 fluorine implant in Si . We have characterized several fluorinated oxides [ 7 ] and polymers using NRA techniques . In the case of SiO : F thin films ...
Page 191
... fluorine concentration or film density and dielectric constant . Special attention was paid to the interaction of fluorine with metals . NRA and X - ray photoelectron spectroscopy ( XPS ) depth profiles showed that fluorine diffuses ...
... fluorine concentration or film density and dielectric constant . Special attention was paid to the interaction of fluorine with metals . NRA and X - ray photoelectron spectroscopy ( XPS ) depth profiles showed that fluorine diffuses ...
Page 251
... fluorine plasma afterglow where the etch rate of the polymers was close to zero ( Fig . 1 ) . DISCUSSION 1. Effects of fluorine and oxygen . The differences in the etch characteristics of SILK and BCB can be analysed based on the ...
... fluorine plasma afterglow where the etch rate of the polymers was close to zero ( Fig . 1 ) . DISCUSSION 1. Effects of fluorine and oxygen . The differences in the etch characteristics of SILK and BCB can be analysed based on the ...
Contents
Overview of Process Integration Issues for LowK Dielectrics | 3 |
Fundamental Aspects of Polymer Metallization | 15 |
LiquidPhase Deposition of LowK Organic | 27 |
Copyright | |
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1998 Materials Research a-C:F ILD adhesion aluminum annealing atoms birefringence bonds capacitance capacitors carbon chemical chemical vapor deposition cm¹ coefficient concentration copper crack velocity curing temperature damascene decrease density dielectric constant diffusion electrical electromigration electron ellipsometry energy etch rate film thickness FLAC fluorine fluorocarbon FTIR hard mask hydrogen in-plane increase integration interconnect interface joule heating layer low dielectric constant low k materials low-k Materials Research Society measured mechanical metal lines modulus moisture MSSQ nanoporous oxide oxygen PECVD Phys planarization plasma etching plasma treatment polyimide polymer polymer films polymerization porosity porous silica xerogel precursors Proc properties pulse ratio reaction refractive index resistance samples Semiconductor shown in Figure shows Si-F silica silicon silsesquioxane SiO2 SiOF films spectra spin-coating spin-on stress structure substrate surface Symp technique thermal stability thin films ULSI wafer wiring xerogel xerogel films